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FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit
June 2008
FPF2200-FPF2202
Features
1.8 to 5.5V Input Voltage Range Typical RDS(ON) = 140m Typical RDS(ON) = 160m
Integrated Load Switch with 500mA High Precision Current Limit
General Description
@ VIN = 5.5V @ VIN = 3.3V The FPF2200-FPF2202 are low RDS(ON) P-Channel MOSFET load switches with high precision current limit value. The input voltage range operates from 1.8V to 5.5V to fulfill today's Ultra Portable Device's supply requirement. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signal. On-chip pull-down is available for output quick discharge when switch is turned off. For the FPF2201, if the constant current condition still persists after 30ms, these parts will shut off the switch and pull the fault signal pin (FLAGB) low. The FPF2200 has an auto-restart feature which will turn the switch on again after 450ms if the ON pin is still active. The FPF2201 do not have this auto-restart feature so the switch will remain off until the ON pin is cycled. For the FPF2202, a current limit condition will immediately pull the fault signal pin low and the part will remain in the constantcurrent mode until the switch current falls below the current limit. For the FPF2200 through FPF2202, the minimum current limit is 500mA with 5% accuracy.
Fixed 500mA Current Limit (min) 5% Accurate Current Limit 72 (typ) Output Discharge Resistance ESD Protected, above 8kV HBM and 2kV CDM
Applications
PDAs Cell Phones GPS Devices MP3 Players Digital Cameras Peripheral Ports Notebook Computer
Pin 1 BOTTOM TOP
Ordering Information
Part
FPF2200 FPF2201 FPF2202
Current Limit (mA)
500 500 500
Current Limit Blanking Time (mS)
30 30 NA
Auto-Restart Time (mS)
450 NA NA
ON Pin Activity
Active HI Active HI Active HI
(c)2008 Fairchild Semiconductor Corporation
FPF2200-FPF2202 Rev. B
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FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit
Typical Application Circuit
TO LOAD VIN VOUT
FPF2200/1/2
OFF ON ON GND FLAGB
Functional Block Diagram
VIN UVLO
THERMAL SHUTDOWN
CONTROL LOGIC
ON CURRENT LIMIT VOUT
Output Discharge FLAGB
GND
FPF2200-FPF2202 Rev. B
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FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit
Pin Configuration
ON 6 GND 5 FLAGB 4
1 N/C 2 VIN 3 VOUT
MicroFET 2x2 6L (BOTTOMVIEW)
Pin Description
Pin
1 2 3 4 5 6
Name
N/C VIN VOUT FLAGB GND ON No Connection
Function
Supply Input: Input to the power switch and the supply voltage for the IC Switch Output: Output of the power switch Fault Output: Active LO, open drain output which indicates an over current, supply under voltage or over temperature state Ground ON/OFF Control Input
Absolute Maximum Ratings
Parameter
VIN, VOUT, ON, FLAGB TO GND Power Dissipation @ TA = 25C Operating and Storage Junction Temperature Thermal Resistance, Junction to Ambient Electrostatic Discharge Protection HBM MM CDM 8000 400 2000 -65
Min.
-0.3
Max.
6 1.2 125 86
Unit
V W C C/W V V V
Recommended Operating Range
Parameter
VIN Ambient Operating Temperature, TA
Min.
1.8 -40
Max.
5.5 85
Unit
V C
Electrical Characteristics
VIN = 1.8 to 5.5V, TA = -40 to +85C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25C.
Parameter
Basic Operation Operating Voltage Quiescent Current
Symbol
VIN
Conditions
Min.
1.8
Typ.
Max.
5.5
Units
V A
IOUT=0mA, VIN=VON=1.8V IQ IOUT=0mA, VIN=VON=3.3V IOUT=0mA, VIN=VON=5.5V VIN Shutdown Current VON=0V, VIN=5.5V, VOUT=short to GND
40 45 55
65 75 85 2.5 A
FPF2200-FPF2202 Rev. B
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FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit
Parameter
VOUT Shutdown Current
Symbol
Conditions
VON=0V, VOUT=5.5V, VIN=short to GND VIN=5.5V, IOUT=200mA, TA=25 C VIN=3.3V, IOUT=200mA, TA=25 C
Min.
Typ.
Max.
1
Units
A
140 160 230 90 72 0.8 1.4
185 210 300 265 105 V 0.5 1.0 V A V A m
On-Resistance
RON
VIN=1.8V, IOUT=200mA, TA=25 C VIN=3.3V, IOUT=200mA, TA=-40C to 85 C
Output Discharge Resistance ON Input Logic High Voltage (ON) ON Input Logic Low Voltage (OFF) On Input Leakage FLAGB Output Logic Low Voltage FLAGB Output High Leakage Current Protections Current Limit Thermal Shutdown Under Voltage Shutdown Under Voltage Shutdown Hysteresis Dynamic Turn On Time Turn Off Time VOUT Rise Time VOUT Fall Time Over Current Blanking Time Auto-Restart Time Current Limit Response Time tON tOFF tRISE tFALL tBLANK tRSTRT UVLO ILIM VIH VIL
VIN=3.3V, VON=0V, IOUT=10mA VIN=1.8V VIN=5.5V VIN=1.8V VIN=5.5V VON = VIN or GND VIN=5.5V, ISINK=100 A VIN=1.8V, ISINK=100 A VIN=5.5V, Switch on -1
1 0.05 0.12 0.1 0.25 1
VIN=3.3V, VOUT = 3.0V, TA=25 C Shutdown Threshold Return from Shutdown Hysteresis VIN increasing
504
530 140 130 10
557
mA C
1.55
1.65 50
1.75
V mV S nS S nS
RL=500 , CL=0.001uF RL=500 , CL=0.001uF RL=500 , CL=0.001uF RL=500 , CL=0.001uF FPF2200, FPF2201 FPF2200 VIN = VON = 3.3V. Over-Current Condition: RLOAD=1.55 15 225
70 600 40 100 30 450 5 60 900
mS mS S
FPF2200-FPF2202 Rev. B
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FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit
Typical Characteristics
70 V ON = VIN 60 SUPPLY CURRENT (uA) 50 40 30 20 10 1 2 3 4 5 6 SUPPLY VOLTAGE (V)
80 70
SUPPLY CURRENT (uA) VON=VIN VIN=3.3V VIN=5.5V VIN=1.8V
60 50 40 30 20 10 -40
85 C 25 C -40 C
o o
o
-15
10
35
o
60
85
TJ, JUNCTION TEMPERATURE ( C)
Figure 1. Quiescent Current vs. Input Voltage
Figure 2. Quiescent Current vs. Temperature
1.30
VON SUPPLY VOLTAGE (V)
VON SUPPLY VOLTAGE (V)
1.6 1.4 VIN=5.5V 1.2 1.0 0.8 0.6 0.4 VIN=3.3V
1.15
VIH
1.00 0.85 0.70 0.55 0.40 1 2 3 4 5
VIL
VIN=1.8V
6
-40
-15
10
35
o
60
85
VIN, SUPPLY VOLTAGE (V)
TJ, JUNCTION TEMPERATURE ( C)
Figure 3. VON vs. Input Voltage
Figure 4. VON High Voltage vs. Temperature
1.4
VON SUPPLY VOLTAGE (V)
0.04
VIN=5.5V ON PIN CURRENT (uA)
1.2 1.0 0.8
0.03 0.02 0.01 0.00 -0.01 -0.02 -0.03
VON = 5.5V
VIN=3.3V VIN=1.8V
0.6 0.4 0.2 -40 -15 10 35
o
VON = 0V
60
85
-40
-15
10
35
o
60
85
TJ, JUNCTION TEMPERATURE ( C)
TJ, JUNCTION TEMPERATURE ( C)
Figure 5. VON Low Voltage vs. Temperature
Figure 6. On Pin Current vs. Temperature
FPF2200-FPF2202 Rev. B
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FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit
Typical Characteristics
600
OUTPUT CURRENT (mA) 600 590 580 570 560 550 540 530 -40
OUTPUT CURRENT (mA)
500 400 300 200 100 0 0 1 2 3
VIN-VOUT (V)
VIN = 3.3V VIN = 1.8V VIN = 5.5V
4
5
6
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (oC)
Figure 7. Current Limit vs. Output Voltage
Figure 8. Current Limit vs. Temperature
300 270 240
RON (mOhms)
300 270 240
RON(mOhms) VIN=1.8V
210 180 150 120 90 60 1.5 2.5 3.5 4.5 5.5
VIN, SUPPLY VOLTAGE (V) 85 C 25oC -40oC
o
210 180 150
VIN=5.5V VIN=3.3V
120 90 -40
-15
10
35
o
60
85
TJ, JUNCTION TEMPERATURE ( C)
Figure 9. RON vs. Input Voltage
Figure 10. RON vs. Temperature
1000 TURN-ON/OFF TIMES (uS)
100 TFALL RISE / FALL TIMES (uS)
100 TOFF 10 TON 1
VIN = 3.3V RL = 500 Ohms COUT = 0.11uF
10
VIN = 3.3V RL = 500 Ohms COUT = 0.11uF
1
TRISE
0.1 -40
-15
10
35
o
60
85
0.1 -40
-15
10
35
o
60
85
TJ, JUNCTION TEMPERATURE ( C)
TJ, JUNCTION TEMPERATURE ( C)
Figure 11. TON / TOFF vs. Temperature
Figure 12. TRISE / TFALL vs. Temperature
FPF2200-FPF2202 Rev. B
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FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit
Typical Characteristics
40 BLANKING TIME (mS) 38 36 34 32 30 28 -40
VIN 2V/DIV IOUT 10mA/DIV VON 2V/DIV VOUT 2V/DIV
-15 10 35 60 85 TJ, JUNCTION TEMPERATURE ( C)
VIN=3.3V, RL=500 , CIN=10 F 100 s/DIV Figure 14. TON Response
Figure 13. TBLANK vs Temperature
VIN 2V/DIV
VIN=3.3V, RL=500 , CIN=10 F
VON 5V/DIV IOUT 500mA/DIV VFLAGB 2V/DIV VOUT 2V/DIV TBLANK VIN=3.3V, RL=5 , CIN=10 F
IOUT 10mA/DIV VON 2V/DIV VOUT 2V/DIV
500ns/DIV Figure 15. TOFF Response
10ms/DIV Figure 16. TBLANK Response
VON 2V/DIV IOUT 500mA/DIV VIN 2V/DIV VOUT 2V/DIV
VIN=3.3V, RL=1.2 , CIN=10 F COUT=10 F
VON 2V/DIV IOUT 500mA/DIV VIN 2V/DIV VOUT 2V/DIV
VIN=5V, RL=1.2 , CIN=10 F COUT=10 F
100 s/DIV Figure 17. Current Limit Response (Output is loaded with 1.2 resistor and COUT=10 F)
500 s/DIV Figure 18. Current Limit Response (Output is loaded with 1.2 resistor and COUT=100 F)
FPF2200-FPF2202 Rev. B
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FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit
Typical Characteristics
VON 2V/DIV IOUT 500mA/DIV VIN=VON=,3. 3V, RL=1.2 , CIN=10 F COUT=1 F VON 2V/DIV IOUT 5A/DIV VIN=3.3V, RL=100 , CIN=10 F COUT=1 F
VOUT 2V/DIV
VOUT 2V/DIV
100 s/DIV
20 s/DIV
Figure 19. Current Limit Response (Switch is powered into a short - Input and enable pins are tied together)
Figure 20. Current Limit Response (Output shorted to GND while the switch is in normal operation)
FPF2200-FPF2202 Rev. B
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FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit
Description of Operation
The FPF2200, FPF2201, and FPF2202 are state of the art High Precision Current Limit switches designed to meet USB OTG (On-The-Go) applications with optimum current for a safe design practice. The core of each device is a 0.16 P-channel MOSFET and a controller capable of functioning over an input operating range of 1.8- 5.5V. The controller protects or offers current limiting, UVLO(undervoltage lockout) and thermal shutdown protection. The minimum current limit value is set to 500mA allowing to draw as much as 500mA from the USB port.
Undervoltage Lockout (UVLO)
The undervoltage lockout turns-off the switch if the input voltage drops below the undervoltage lockout threshold. With the ON pin active the input voltage rising above the undervoltage lockout threshold will cause a controlled turn-on of the switch which limits current over-shoots.
Output Discharge Resistor
The FPF2200/1/2 family contains an 80 on-chip load resistor for quick output discharge when the switch is turned off. This features become more attractive when application requires large output capacitor to be discharged when switch turns-off. However, VOUT pin should not be connected directly to the battery source due to the discharge mechanism of the load switch.
On/Off Control
The ON pin is active high, and controls the state of the switch. Applying a continuous high signal will hold the switch in the ON state. The switch will move into the OFF state when the active high is removed, or if a fault is encountered. For all versions, an undervoltage on VIN or a junction temperature in excess of 140C overrides the ON control to turn off the switch. In addition, excessive currents will cause the switch to turn off in the FPF2200 and FPF2201. The FPF2200 has an Auto-Restart feature which will automatically turn the switch ON again after 450ms. For the FPF2201, the ON pin must be toggled to turn-on the switch again. The FPF2202 does not turn off in response to an over current condition but instead remains operating in a constant current mode so long as ON is active and the thermal shutdown or UVLO have not activated.
Thermal Shutdown
The thermal shutdown protects the die from internally or externally generated excessive temperatures. During an overtemperature condition the FLAGB is activated and the switch is turned-off. The switch automatically turns-on again if temperature of the die drops below the threshold temperature.
Upon the detection of an over-current condition, an input UVLO, or an over-temperature condition, the FLAGB signals the fault mode by activating LO. In the event of an over-current condition for the FPF2200 and FPF2201, the FLAGB goes LO at the end of the blanking time while FLAGB goes LO immediately for the FPF2202. If the over-current condition lasts longer than blanking time, FLAGB remains LO through the Auto-Restart Time for the FPF2200 while for the FPF2201, FLAGB is latched LO and ON must be toggled to release it. With the FPF2202, FLAGB is LO during the faults and immediately returns HI at the end of the fault condition. FLAGB is an open-drain MOSFET which requires a pull-up resistor between VIN and FLAGB. During shutdown, the pull-down on FLAGB is disabled to reduce current draw from the supply. A 100K pull up resistor is recommended to be used in the application.
Fault Reporting
Current Limiting
The current limit ensures that the current through the switch doesn't exceed a maximum value while not limiting at less than a minimum value. The minimum current at which the parts will limit is set to 500mA. The FPF2200 and FPF2201 have a blanking time of 30ms (nominal) during which the switch will act as a constant current source. At the end of the blanking time, the switch will be turned-off. The FPF2202 has no current limit blanking period so it will remain in a constant current state until the ON pin is deactivated or the thermal shutdown turns-off the switch.
FPF2200-FPF2202 Rev. B
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FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit
Application Information
Input Capacitor
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch is turned on into a discharged load capacitor or a short-circuit, a capacitor is recommended to be placed between VIN and GND. A 1uF ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop. A 0.1uF capacitor COUT, should be placed between VOUT and GND. This capacitor will prevent parasitic board inductances from forcing VOUT below GND when the switch turns-off. For the FPF2200 and FPF2201, the total output capacitance needs to be kept below a maximum value, COUT(max), to prevent the part from registering an over-current condition and turning-off the switch. The maximum output capacitance can be determined from the following formula: COUT (Max) = ILIM (Max) X tBLANK (Min) VIN
PCB Layout Recommendations
For best performance, all traces should be as short as possible. To be more effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces for VIN, VOUT and GND will help minimize parasitic electrical effects along with minimizing the case to ambient thermal impedance.
Output Capacitor
An improper layout could result in higher junction temperature and triggering the thermal shutdown protection feature. This concern applies when the switch is set at higher current limit value and an over-current condition occurs. In this case, the power dissipation of the switch, from the formula below, could exceed the maximum absolute power dissipation of 1.2W. PD = (VIN - VOUT) x ILIM (Max) The following techniques have been identified to improve the thermal performance of this family of devices. These techniques are listed in order of the significance of their impact. 1. Thermal performance of the load switch can be improved by connecting pin7 of the DAP (Die Attach Pad) to the GND plane of the PCB. 2. Embedding two exposed through-hole vias into the DAP (pin7) provides a path for heat to transfer to the back GND plane of the PCB. A drill size of Round, 14 mils (0.35mm) with 1-ounce copper plating is recommended to result in appropriate solder reflow. A smaller size hole prevents the solder from penetrating into the via, resulting in device lift-up. Similarly, a larger via-hole consumes excessive solder, and may result in voiding of the DAP.
Improving Thermal Performance
Power Dissipation
During normal on-state operation, the power dissipated in the device will depend upon the level at which the current limit is set. The maximum allowed setting for the current limit is 500mA and will result in a power dissipation of: P = (ILIM)2 * RON = (0.5)2 * 0.16 = 40mW
If the part goes into current limit, the maximum power dissipation will occur when the output is shorted to ground. For the FPF2200, the power dissipation will scale by the AutoRestart Time, tRSTRT, and the Over Current Blanking Time, tBLANK, so that the maximum power dissipated is: P (Max) = tBLANK tBLANK + tRSTRT 30 30 + 450 * VIN (Max) * ILIM (Max)
=
* 5.5 * 0.5 = 0.17W
Note this is below the maximum package power dissipation, and the thermal shutdown feature will act as additional safety to protect the part from damage due to excessive heating. The junction temperature is only able to increase to the thermal shutdown threshold. Once this temperature has been reached, toggling ON will not turn-on the switch until the junction temperature drops. For the FPF2202, a short on the output will cause the part to operate in a constant current state dissipating a worst case power of: P (Max) = VIN (MAX) * ILIM (MAX) = 5.5 * 0.557 = 3.064W
Figure 21: Two through hole open vias embedded in DAP 3. The VIN, VOUT and GND pins will dissipate most of the heat generated during a high load current condition. The layout suggested in Figure 23 provides each pin with adequate copper so that heat may be transferred as efficiently as possible out of the device. The low-power FLAGB and ON pin traces may be laid-out diagonally from the device to maximize the area available to the ground pad. Placing the input and output capacitors as close to the device as possible also contributes to heat dissipation, particularly during high load currents.
This large amount of power will activate the thermal shutdown and the part will cycle in and out of thermal shutdown so long as the ON pin is active and the short is present.
FPF2200-FPF2202 Rev. B
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FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit
Figure 22: X-Ray result (bottom view with 45o angle)
Figure 25: Bottom and ASB Layers Figure 23: Proper layout of output and ground copper area Figure 26: Zoom in to Top layer
FPF22XX Demo board has components and circuitry to demonstrate FPF2223/4/5 load switches functions and features. R4 resistor with 0 value is used for measuring the output current. Load current can be scoped by removing the R4 resistor and soldering a current loop to the R4 footprint. Thermal performance of the board is improved using a few techniques recommended in the layout recommendations section of datasheet. R3 resistor should be left open for FPF220X family.
FPF22XX Demo Board
Figure 24: Top, SST, and AST Layers
FPF2200-FPF2202 Rev. B
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FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit
Dimensional Outline and Pad Layout
FPF2200-FPF2202 Rev. B
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* EZSWITCHTM and FlashWriter(R) are trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative / In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. This datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.
Rev. I34
2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
Preliminary
First Production
No Identification Needed Obsolete
Full Production Not In Production
(c) 2008 Fairchild Semiconductor Corporation
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